照明工程学报

2021, v.32(01) 31-36

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LED封装胶耐热性实验研究
Experimental Study on Heat Resistance of LED Packaging Adhesive

林远彬;秦快;文波;
LIN Yuanbin;QIN Kuai;WEN Bo;Foshan NationStar Optoelectronics Co.,Ltd;

摘要(Abstract):

利用分光测色仪、光电测试机和推力测试机等测试手段,实验测定了不同加热烘烤条件下LED的色差、光电参数及树脂推力,研究了不同LED封装胶的耐热性差异,并为行业提供了LED产品的维修方案。
The color difference,photoelectric parameters and resin thrust of LED under different heating and baking conditions were measured by means of spectrophotometer,photoelectric testing machine and thrust tester.The heat resistance difference of different LED packaging adhesives was studied,and the maintenance scheme for LED products was provided for industry.

关键词(KeyWords): 色差;光电参数;树脂推力;LED封装胶;耐热性
color difference;photoelectric parameters;resin thrust;LED packaging adhesive;heat resistance

Abstract:

Keywords:

基金项目(Foundation): 佛山市核心技术攻关项目(1920001000236)

作者(Authors): 林远彬;秦快;文波;
LIN Yuanbin;QIN Kuai;WEN Bo;Foshan NationStar Optoelectronics Co.,Ltd;

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