大功率LED散热封装技术研究Technical Research on Heat-Release Package of High-Power LEDs
苏达;王德苗;
Su Da Wang Demiao(Department of Information Science & Electronics Engineering,Zhejiang University, Hangzhou 310027)
摘要(Abstract)：
如何提高大功率LED的散热能力,是LED器件封装和器件应用设计要解决的核心问题。本文详细分析了国内外大功率LED散热封装技术的研究现状,总结了其发展趋势并提出减少内部热沉可能是今后的发展方向。
How to improve the heat-sinking capability is one of the key technical problems for the package and application design of device concerned with high-power LEDs. In this paper, the present technical research on heat-release package of high-power LEDs is analyzed, and the trend is summarized. Besides, it suggests that reducing the internal heat sink may be one of the developments in the future.
关键词(KeyWords)：
大功率LED;散热;封装
high power LED;heat release;package
基金项目(Foundation):
作者(Authors):
苏达;王德苗;
Su Da Wang Demiao(Department of Information Science & Electronics Engineering,Zhejiang University, Hangzhou 310027)
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