照明工程学报

2011, v.22(03) 30-36

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侧面送风冷却LED的热封装方法及其三维数值仿真研究
Thermal Packaging Method of LED via Side Air Ventilation Based Cooling and Its 3-D Conceptual Simulation Study

马璐;刘静;
Ma Lu Liu Jing(Technical Institute of Physics and Chemistry,Chinese Academy of Science,Beijing 100190)

摘要(Abstract):

LED(Light Emitting Diode)芯片结温的高低直接影响其出光效率、工作寿命和可靠性。本文提出一种旨在确保LED在结温下安全、低噪音、稳定运行的侧面出风封装新方法。建立了该方法的三维传热学模型,研究了不同风压和不同LED芯片功率对其温度的影响。数值仿真结果表明:新型散热方法能够有效地冷却大功率LED,比如能使40W LED在120Pa风压,27℃环境温度时温升仅为15℃;LED芯片的平均温度与其整个模块的功率呈线性增长关系;在使用该系统对LED进行冷却时,应平衡好LED芯片温度、风机功耗、系统尺寸的关系,并合理地选取进风口处风压。
The junction temperature of LED chip directly influences its light-emitting efficiency,working life and reliability.In this paper,a novel packaging method for cooling LED chip with side air outlet is proposed to ensure it work safely and steadily under the rated junction temperature.A three-dimensional heat transfer model for the system was established to evaluate the effects of different inlet air pressure and input power of chip on the LED temperature.Numerical simulations show that: the new system can cool high power LED module effectively by such a degree that the temperature rise for a 40 W LED module will fall below 15℃ when the inlet air pressure is 120 Pa and the ambient temperature is 27 ℃;Further,the average temperature of LED chip increases linearly with the input power of the module.When applying the present system to cool the LED,one needs to balance the relation among the temperature of LED chip,power consumption of the fan,the size of the whole system,and choose a proper inlet air pressure.

关键词(KeyWords): 大功率LED;侧面出风口;散热;风机
high power LED;side air outlet;heat dissipation;fan

Abstract:

Keywords:

基金项目(Foundation): 中国科学院理化技术研究所所长基金资助

作者(Authors): 马璐;刘静;
Ma Lu Liu Jing(Technical Institute of Physics and Chemistry,Chinese Academy of Science,Beijing 100190)

DOI: 10.13223/j.cnki.ciej.2011.03.016

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